Part Number Hot Search : 
A1526 MIC52 2SC30 BR201 D2382 BSS145 SST5485 0831516
Product Description
Full Text Search
 

To Download SI4946BEY Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 SI4946BEY
New Product
Vishay Siliconix
Dual N-Channel 60-V (D-S) 175 _C MOSFET
PRODUCT SUMMARY
VDS (V)
60
FEATURES
ID (A)
6.5 5.8
rDS(on) (W)
0.041 @ VGS = 10 V 0.052 @ VGS = 4.5 V
Qg (Typ)
9.2 9 2 nC
D TrenchFETr Power MOSFET D 175_C Maximum Junction Temperature D 100% Rg Tested
SO-8
S1 G1 S2 G2 1 2 3 4 Top View Ordering Information: SI4946BEY-T1--E3 (Lead (Pb)-Free) S1 N-Channel MOSFET S2 N-Channel MOSFET 8 7 6 5 D1 D1 D2 D2 G1 G2 D1 D2
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage TC = 25_C Continuous Drain Current (TJ = 150_C) TC = 70_C TA = 25_C TA = 70_C Pulsed Drain Current Continuous Source Drain Diode Current Source-Drain Avalanche Current Single-Pulse Avalanche Energy TC = 25_C TA = 25_C L = 0 1 mH 0.1 TC = 25_C Maximum Power Dissipation TC = 70_C TA = 25_C TA = 70_C Operating Junction and Storage Temperature Range TJ, Tstg PD IDM IS IAS EAS ID
Symbol
VDS VGS
Limit
60 "20 6.5 5.5 5.3a, b 4.4a, b 30 3.1 2a, b 12 7.2 3.7 2.6 2.4a, b 1.7a, b -50 to 175
Unit
V
A
mJ
W
_C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta, c Maximum Junction-to-Foot (Drain) t p 10 sec Steady State
Symbol
RthJA RthJF
Typical
50 33
Maximum
62.5 41
Unit
_C/W
Notes: a. Surface Mounted on 1" x 1" FR4 Board. b. t = 10 sec c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components. d. Maximum under steady state conditions is 110 _C/W. Document Number: 73411 S-51013--Rev. A, 23-May-05 www.vishay.com
1
SI4946BEY
Vishay Siliconix
New Product
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea VDS DVDS/TJ DVGS(th)/TJ VGS(th) IGSS IDSS ID(on) rDS(on) gfs VGS = 0 V, ID = 250 mA ID = 250 mA VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 60 V, VGS = 0 V VDS = 60 V, VGS = 0 V, TJ = 55_C VDS w 5 V, VGS = 10 V VGS = 10 V, ID = 5.3 A VGS = 4.5 V, ID = 4.7 A VDS = 15 V, ID = 5.3 A 30 0.033 0.041 24 0.041 0.052 1.0 60 53 -6.7 2.4 3.0 "100 1 10 V mV/_C V nA mA A W S
Symbol
Test Condition
Min
Typ
Max
Unit
Dynamicb
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf VDD = 30 V, RL = 6.8 W ID ^ 4.4 A, VGEN = 10 V, Rg = 1 W VDD = 30 V, RL = 6.8 W ID ^ 4.4 A, VGEN = 4.5 V, Rg = 1 W f = 1 MHz 3.1 VDS = 30 V, VGS = 10 V, ID = 5.3 A VDS = 30 V, VGS = 5 V, ID= 5.3 A VDS = 30 V, VGS = 0 V, f = 1 MHz 840 71 44 17 9.2 3.3 3.7 6.5 20 120 20 30 10 12 25 10 9.5 30 180 30 45 15 20 40 15 ns W 25 12 nC pF
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current Pulse Diode Forward Currenta Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time Notes a. Pulse test; pulse width v 300 ms, duty cycle v 2%. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. www.vishay.com Document Number: 73411 S-51013--Rev. A, 23-May-05 IS ISM VSD trr Qrr ta tb IF = 4.4 A, di/dt = 100 A/ms, TJ = 25_C 25 C IS = 2 A 0.8 25 25 18 7 TC = 25_C 3.1 30 1.2 50 50 A V ns nC ns
2
SI4946BEY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
30 25 I D - Drain Current (A) 20 4V 15 10 5 3V 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Vishay Siliconix
Output Characteristics
VGS = 10 thru 5 V
10
Transfer Characteristics
I D - Drain Current (A)
8
6
4 TC = 150_C -55_C 2 25_C
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
0.100
On-Resistance vs. Drain Current and Gate Voltage
1200 1000 C - Capacitance (pF)
Capacitance
rDS(on) - On-Resistance (mW)
0.080
Ciss 800 600 400 200 0 Crss 0 10 20 30 40 50 60
0.060 VGS = 4.5 V 0.040 VGS = 10 V 0.020
Coss
0.000 0 5 10 15 20 25 30
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
10 V GS - Gate-to-Source Voltage (V) ID = 5.3 A 8
Gate Charge
2.2 2.0 rDS(on) - On-Resiistance (Normalized) 1.8 1.6 1.4 1.2 1.0 0.8
On-Resistance vs. Junction Temperature
ID = 5.3 A
6
VDS = 30 V VDS = 48 V
VGS = 10 V
VGS = 4.5 V
4
2
0 0 4 8 12 16 20 Qg - Total Gate Charge (nC) Document Number: 73411 S-51013--Rev. A, 23-May-05
0.6 -50
-25
0
25
50
75
100
125
150
175
TJ - Junction Temperature (_C) www.vishay.com
3
SI4946BEY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
30 rDS(on) - Drain-to-Source On-Resistance (W) 0.10 ID = 5.3 A 0.08 TJ = 150_C 0.06
On-Resistance vs. Gate-to-Source Voltage
I S - Source Current (A)
10
TJ = 175_C
0.04 TJ = 25_C
TJ = 25_C
0.02
1 0.00 0.2 0.4 0.6 0.8 1.0 1.2 1.4 VSD - Source-to-Drain Voltage (V)
0.00 0 2 4 6 8 10 VGS - Gate-to-Source Voltage (V)
Threshold Voltage
3.0 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 -50 0 0.01 5 Power (W) VGS(th) (V) 20 ID = 250 mA 15 25
Single Pulse Power, Junction-to-Ambient
10
-25
0
25
50
75
100
125
150
175
0.1
1 Time (sec)
10
100
1000
TJ - Temperature (_C) 100
Safe Operating Area, Junction-to-Ambient
10 I D - Drain Current (A)
*Limited by rDS(on) 100 ms
1
1 ms 10 ms
0.1
100 ms TA = 25_C Single Pulse 1s 10 s dc 10 100
0.01 0.01 0.1 1 VDS - Drain-to-Source Voltage (V) *VGS u minimum VGS at which rDS(on) is specified www.vishay.com Document Number: 73411 S-51013--Rev. A, 23-May-05
4
SI4946BEY
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
8 7 6 ID - Drain Current (A) Power (W) 5 4 3 2 1 0 0 25 50 75 100 125 150 175
Vishay Siliconix
Current De-Rating*
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 25 50
Power, Junction-to-Case
75
100
125
150
175
TC - Case Temperature (_C)
TC - Case Temperature (_C)
100
Single Pulse Avalanche Capability
IC - Peak Avalanche Current (A)
10
TA + 1 0.000001
BV * V DD
L @ ID
0.00001
0.0001
0.001
TA - Time In Avalanche (sec)
*The power dissipation PD is based on TJ(max) = 175_C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
Document Number: 73411 S-51013--Rev. A, 23-May-05
www.vishay.com
5
SI4946BEY
Vishay Siliconix
New Product
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
2 1
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1 0.05 0.02 Single Pulse 0.01 10-4 10-3 10-2 10-1 1 Square Wave Pulse Duration (sec)
Notes: PDM t1
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA = 85_C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
600
2 1
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2 0.1 0.1
0.05 0.01 10-4 0.02 10-3
Single Pulse
10-2 Square Wave Pulse Duration (sec)
10-1
1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?73411. www.vishay.com Document Number: 73411 S-51013--Rev. A, 23-May-05
6
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000 Revision: 08-Apr-05
www.vishay.com 1


▲Up To Search▲   

 
Price & Availability of SI4946BEY

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X